SMT Proses Teknologi Pemasangan Permukaan

Perakitan satu sisi
Incoming material inspection => Silk screen solder paste (sMD glue) => SMD => Drying (curing) => Reflow soldering => Cleaning => Inspection =>Mengolah lagi
Perakitan dua sisi
A: Incoming material inspection => Silk screen solder paste (sMD glue) on PCB A side => SMD PCB Silk screen solder paste (sMD glue) on PCB B side => SMD => Drying => Reflow soldering (preferably only on B side => Cleaning => Inspection =>Pengerjaan ulang) .
B: Incoming material inspection => Silk screen solder paste (sMD glue) on PCB A side => SMD => Drying (curing) => Reflow soldering on A side => Cleaning => Flip board => SMD glue on PCB B side => SMD => Curing => Wave soldering on B side => Cleaning => Inspection =>Mengolah lagi)
Proses ini cocok untuk solder reflow di PCB A sisi dan gelombang solder di sisi B . Proses ini cocok untuk SMD yang dirakit di sisi B PCB ketika hanya ada pin SOT atau SOIC (28) atau kurang .
Proses perakitan campuran satu sisi
Incoming material inspection => Screen printing solder paste on the A side of the PCB (applying SMD glue) => SMD => Drying (curing) => Reflow soldering => Cleaning => Plug-in => Wave soldering => Cleaning => Inspection =>Mengolah lagi
Proses perakitan campuran dua sisi
A: Incoming material inspection => Apply SMD glue on the B side of the PCB => SMD => Curing => Flip board => Plug-in on the A side of the PCB => Wave soldering => Cleaning => Inspection =>Mengolah lagi
Terapkan terlebih dahulu dan kemudian masukkan, yang cocok untuk situasi di mana ada lebih banyak komponen SMD daripada komponen diskrit .
B: Incoming material inspection => Plug-in on the A side of the PCB (pin bending) => Flip board => Apply SMD glue on the B side of the PCB => SMD => Curing => Flip board => Wave soldering => Cleaning => Inspection =>Mengolah lagi
Masukkan terlebih dahulu dan kemudian berlaku, yang cocok untuk situasi di mana ada lebih banyak komponen diskrit daripada komponen SMD .
C: Incoming material inspection => PCB A side screen printing solder paste => SMD => Drying => Reflow soldering => Plug-in, pin bending => Flip board => PCB B side SMD glue => SMD => Curing => Flip board => Wave soldering => Cleaning => Inspection =>Kerjakan ulang rakitan campuran samping, b sisi b smd .
D: Incoming material inspection => PCB B side SMD glue => SMD => Curing => Flip board => PCB A side screen printing solder paste => SMD => Reflow soldering => Plug-in => Wave soldering => Cleaning => Inspection => Rework A side mixed assembly, B side SMD. First paste SMD on both sides, reflow soldering, then plug-in, wave soldering E: Incoming material inspection => Silk screen solder paste (smear patch glue) on the B side of the PCB => Smear => Drying (curing) => Reflow soldering => Flip board => Silk screen solder paste on the A side of the PCB => Smear => Drying = Reflow soldering 1 (local soldering can be used) => Plug-in => Wave soldering 2 (if there are few plug-in components, manual soldering can be used) => Cleaning => Inspection =>Kerjakan ulang pemasangan samping, B sisi B Mixed Mounting .
Proses perakitan dua sisi
A: Inspeksi material yang masuk, pasta solder layar sutra (lem smear patch) di sisi A PCB, smear, pengeringan (curing), solder sisi reflow, pembersihan, papan flip; Pasta solder layar sutra (lem smear lem) di sisi B dari PCB, smear, pengeringan, solder reflow (lebih disukai hanya untuk sisi B, pembersihan, inspeksi, pengerjaan ulang)
Proses ini cocok untuk memasang SMD besar seperti PLCC di kedua sisi PCB .
B: Inspeksi bahan yang masuk, cetak layar pasta solder di sisi PCB (menerapkan lem SMD), SMD, pengeringan (curing), solder reflow di sisi A, pembersihan, dan membalik; Menerapkan lem SMD di sisi B dari PCB, SMD, Curing, Wave Soldering di Sisi B, Pembersihan, Inspeksi, dan Kerajinan Kerajinan) Proses ini cocok untuk reflow di sisi A dari PCB .