Struktur papan kaku-flex

Rigid-flex boards consist of a rigid area, a flexible area, and a transition area between the two. The rigid area usually uses a rigid substrate such as FR-4, with multiple layers of copper foil and dielectric layers superimposed, just like a traditional multi-layer PCB, providing a solid foundation for component installation. The flexible area uses polyimide as the substrate, with copper foil and cover film, giving the board the ability to bend. The transition area is the key part to achieve a smooth connection between rigidity and flexibility. Through a specific lamination process, the continuity of electrical connection and mechanical properties between different areas is guaranteed.